DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

GS815018AB 查看數據表(PDF) - Giga Semiconductor

零件编号
产品描述 (功能)
生产厂家
GS815018AB Datasheet PDF : 25 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Product Preview
GS815018/36AB-357/333/300/250
Register-Register Late Write, Pipelined Read Truth Table
DQ
CK ZZ SS SW Bx G
Current Operation
(tn)
DQ
(tn+1)
X
1
X
X
X
X
Sleep (Power Down) mode
Hi-Z
Hi-Z
0
1
X
X
X
Deselect
***
Hi-Z
0
0
1
X
1
Read
Hi-Z/
Hi-Z
0
0
1
X
0
Read
***
Q(tn)
0
0
0
0
X
Write All Bytes
***
D(tn)
0
0
0
X
X
Write Bytes with Bx = 0
***
D(tn)
0
0
0
1
X
Write (Abort)
***
Hi-Z
Notes:
1. If one or more Bx = 0, then B = “T” else B = “F”.
2. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”.
3. “***” indicates that the DQ input requirement/output state and CQ output state are determined by the previous operation.
4. DQs are tristated in response to Bank Deselect, Deselect, and Write commands, one full cycle after the command is sampled.
5. CQs are tristated in response to Bank Deselect commands only, one full cycle after the command is sampled.
6. Up to three (3) Continue operations may be initiated after a Read or Write operation is initiated to burst transfer up to four (4) distinct pieces
of data per single external address input. If a fourth (4th) Continue operation is initiated, the internal address wraps back to the initial exter-
nal (base) address.
Rev: 1.05 10/2005
6/25
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]