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HM64YLB36514 查看數據表(PDF) - Renesas Electronics

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HM64YLB36514 Datasheet PDF : 22 Pages
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HM64YLB36514 Series
Absolute Maximum Ratings
Parameter
Symbol Rating
Unit Notes
Input voltage on any pin
Core supply voltage
Output supply voltage
Operating temperature
Storage temperature
Output short-circuit current
Latch up current
Package junction to top thermal resistance
V
IN
VDD
VDDQ
TOPR
TSTG
IOUT
ILI
θJ-top
0.5
to
V
DDQ
+
0.5
0.5 to +3.13
0.5 to +2.1
0 to +85
55 to +125
25
200
6.5
V
1, 4
V
1
V
1, 4
°C
°C
mA
mA
°C/W 5
Package junction to board thermal resistance
θJ-board 12
°C/W 5
Notes: 1. All voltage is referenced to V .
SS
2. Permanent device damage may occur if absolute maximum ratings are exceeded. Functional
operation should be restricted the operation conditions. Exposure to higher voltages than
recommended voltages for extended periods of time could affect device reliability.
3. These CMOS memory circuits have been designed to meet the DC and AC specifications
shown in the tables after thermal equilibrium has been established.
4. The following supply voltage application sequence is recommended: VSS, VDD, VDDQ, VREF then VIN.
Remember, according to the absolute maximum ratings table, VDDQ is not to exceed 2.1 V,
whatever the instantaneous value of V .
DDQ
5. See figure below.
θJ-top
Thermocouple
Thermo grease
θJ-board
Teflon block
Thermocouple
Water
Cold plate
SRAM
Teflon block
Water
SRAM
JEDEC/2S2P BGA
Thermal board
Water
Thermo grease
Cold plate
Water
JEDEC/2S2P BGA
Thermal board
Rev.0.10, May.15.2003, page 7 of 22

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