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IDT72413 查看數據表(PDF) - Integrated Device Technology

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IDT72413
IDT
Integrated Device Technology IDT
IDT72413 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
IDT72413
CMOS PARALLEL 64 x 5-BIT FIFO WITH FLAGS
MILITARY AND COMMERCIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS
(Commercial: VCC = 5.0V ± 10%, TA = 0°C to +70°C; Military: VCC = 5.0V ± 10%, TA = –55°C to +125°C)
Symbol
Parameter
Test Conditions
Min.
Max.
Unit
IIL
Low-Level Input Current
VCC = Max., GND VI VCC
-10
µA
IIH
High-Level Input Current
VCC = Max., GND VI VCC
10
µA
VOL
Low-Level Output Current
VCC = Min. IOL (Q0-4) Mil. 12mA
0.4
V
Com'l. 24mA
IOL (IR, OR)(1)
8mA
IOL (HF, AF/E)
8mA
VOH
High-Level Output Current
VCC = Min. IOH (Q0-4)
–4mA
2.4
V
IOH (IR, OR)
–4mA
IOH (HF, AF/E) –4mA
IOS(2)
Output Short-Circuit Current
VCC = Max. VO = 0V
-20
-110
mA
IHZ
Off-State Output Current
VCC = Max. VO = 2.4V
20
µA
ILZ
ICC(3)
Supply Current
VCC = Max. VO = 0.4V
-20
VCC = Max., OE=HIGH Mil.
Inputs LOW, f=25MHz Com'l.
70
mA
60
NOTES:
2748 tbl 04
1. Care should be taken to minimize as much as possible the DC and capactive load on IR and OR when operating at frequencies above 25mHz.
2. Not more than one output should be shorted at a time and duration of the short circuit should not exceed one second. Guaranteed by design, but not
currently tested.
3. For frequencies greater than 25MHz, ICC = 60mA + (1.5mA x [f - 25MHz]) commercial and ICC = 70mA + (1.5mA x [f - 25MHz]) military.
OPERATING CONDITIONS
(Commercial: VCC = 5.0V ± 10%, TA = 0°C to +70°C; Military: VCC = 5.0V ± 10%, TA = –55°C to +125°C)
Commercial
Military & Commercial Military & Commercial
Symbol
tSIH(1)
tSIL(1)
Parameters
Shift in HIGH Time
Shift in LOW TIme
Figure
2
2
IDT72413L45
Min.
Max.
9
11
IDT72413L35
Min. Max.
9
17
IDT72413L25
Min. Max. Unit
16
ns
20
ns
tIDS
Input Data Set-up
2
0
0
0
ns
tIDH
tSOH(1)
Input Data Hold Time
Shift Out HIGH Time
2
13
15
25
ns
5
9
9
16
ns
tSOL
Shift Out LOW Time
5
11
17
20
ns
tMRW Master Reset Pulse
8
20
30
35
ns
tMRS
Master Reset Pulse to SI
8
20
35
35
ns
NOTE:
2748 tbl 05
1. Since the FIFO is a very high-speed device, care must be excercised in the design of the hardware and timing utilized within the design. Device grounding
and decoupling are crucial to correct operation as the FIFO will respond to very small glitches due to long reflective lines, high capacitances and/or poor
supply decoupling and grounding. A monolithic ceramic capacitor of 0.1µF directly between VCC and GND with very short lead length is recommended.
5.02
3

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