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LH28F160S5-L70 查看數據表(PDF) - Sharp Electronics

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LH28F160S5-L70 Datasheet PDF : 55 Pages
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LH28F160S5-L/S5H-L
PIN DESCRIPTION
SYMBOL
TYPE
A0-A20
INPUT
DQ0-DQ15
INPUT/
OUTPUT
CE0#, CE1# INPUT
RP#
OE#
WE#
INPUT
INPUT
INPUT
OPEN
STS
DRAIN
OUTPUT
WP#
BYTE#
INPUT
INPUT
VPP
SUPPLY
VCC
GND
NC
SUPPLY
SUPPLY
NAME AND FUNCTION
ADDRESS INPUTS : Inputs for addresses during read and write operations. Addresses
are internally latched during a write cycle.
A0 : Byte Select Address. Not used in x16 mode (can be floated).
A1-A4 : Column Address. Selects 1 of 16-bit lines.
A5-A15 : Row Address. Selects 1 of 2 048-word lines.
A16-A20 : Block Address.
DATA INPUT/OUTPUTS :
DQ0-DQ7 : Inputs data and commands during CUI write cycles; outputs data during
memory array, status register, query, and identifier code read cycles. Data pins float to
high-impedance when the chip is deselected or outputs are disabled. Data is internally
latched during a write cycle.
DQ8-DQ15 : Inputs data during CUI write cycles in x16 mode; outputs data during memory
array read cycles in x16 mode; not used for status register, query and identifier code read
mode. Data pins float to high-impedance when the chip is deselected, outputs are
disabled, or in x8 mode (BYTE# = VIL). Data is internally latched during a write cycle.
CHIP ENABLE : Activates the device’s control logic, input buffers decoders, and sense
amplifiers. Either CE0# or CE1# VIH deselects the device and reduces power
consumption to standby levels. Both CE0# and CE1# must be VIL to select the devices.
RESET/DEEP POWER-DOWN : Puts the device in deep power-down mode and resets
internal automation. RP# VIH enables normal operation. When driven VIL, RP# inhibits
write operations which provide data protection during power transitions. Exit from deep
power-down sets the device to read array mode.
OUTPUT ENABLE : Gates the device’s outputs during a read cycle.
WRITE ENABLE : Controls writes to the CUI and array blocks. Addresses and data are
latched on the rising edge of the WE# pulse.
STS (RY/BY#) : Indicates the status of the internal WSM. When configured in level
mode (default mode), it acts as a RY/BY# pin. When low, the WSM is performing an
internal operation (block erase, full chip erase, (multi) word/byte write or block lock-bit
configuration). STS High Z indicates that the WSM is ready for new commands, block
erase is suspended, and (multi) word/byte write is inactive, (multi) word/byte write is
suspended or the device is in deep power-down mode. For alternate configurations of
the STATUS pin, see the Configuration command (Table 3 and Section 4.14).
WRITE PROTECT : Master control for block locking. When VIL, locked blocks can not
be erased and programmed, and block lock-bits can not be set and reset.
BYTE ENABLE : BYTE# VIL places device in x8 mode. All data are then input or output
on DQ0-7, and DQ8-15 float. BYTE# VIH places the device in x16 mode, and turns off the
A0 input buffer.
BLOCK ERASE, FULL CHIP ERASE, (MULTI) WORD/BYTE WRITE, BLOCK LOCK-
BIT CONFIGURATION POWER SUPPLY : For erasing array blocks, writing bytes or
configuring block lock-bits. With VPP VPPLK, memory contents cannot be altered. Block
erase, full chip erase, (multi) word/byte write and block lock-bit configuration with an
invalid VPP (see Section 6.2.3 "DC CHARACTERISTICS") produce spurious results
and should not be attempted.
DEVICE POWER SUPPLY : Internal detection configures the device for 5 V operation.
Do not float any power pins. With VCC VLKO, all write attempts to the flash memory
are inhibited. Device operations at invalid VCC voltage (see Section 6.2.3 "DC
CHARACTERISTICS") produce spurious results and should not be attempted.
GROUND : Do not float any ground pins.
NO CONNECT : Lead is not internal connected; recommend to be floated.
-5-

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