MASWGM0003-DIE 查看數據表（PDF） - Tyco Electronics
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MASWGM0003-DIE Datasheet PDF : 5 Pages
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Switch, Single-Pole, Double-Throw
2.0—8.0 GHz
Mechanical Information
Chip Size: 2.054 x 1.294 x 0.075 mm (81 x 51 x 3)
MASWGM0003-DIE
903231 —
Preliminary Information
1.148mm.
0.747mm.
OUT
1
VEE
A
1.294mm.
OUT
2
0.747mm.
0.155mm.
COM
0
0
Figure 3. Die Layout
Bond Pad Dimensions
Pad
RF: COMMON, OUT1, OUT2
Digital Driver Voltage VEE
A (TTL Control)
Size (μm)
125 x 125
125 x 125
125 x 125
Size (mils)
5x5
5x5
5x5
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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