Switch, Single-Pole, Double-Throw
2.0—8.0 GHz
Mechanical Information
Chip Size: 2.054 x 1.294 x 0.075 mm (81 x 51 x 3)
MASWGM0003-DIE
903231 —
Preliminary Information
1.148mm.
0.747mm.
OUT
1
VEE
A
1.294mm.
OUT
2
0.747mm.
0.155mm.
COM
0
0
Figure 3. Die Layout
Bond Pad Dimensions
Pad
RF: COMMON, OUT1, OUT2
Digital Driver Voltage VEE
A (TTL Control)
Size (μm)
125 x 125
125 x 125
125 x 125
Size (mils)
5x5
5x5
5x5
4
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