MAX3658(2004) 查看數據表（PDF） - Maxim Integrated
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MAX3658 Datasheet PDF : 14 Pages
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VCC
400Ω
20kΩ
FILT
20pF
Figure 7. FILT Interface
VCC
MON
622Mbps, Low-Noise, High-Gain
Transimpedance Preamplifier
Pad Coordinates
Table 2 gives center pad coordinates for the MAX3658
bond pads. Refer to application note HFAN-8.0.1:
Understanding Bonding Coordinates and Physical Die
Size for more information on bond-pad coordinates.
Table 2. Bond-Pad Information
PAD
BP1
BP2
BP3
BP4
BP5
BP6
BP7
BP8
BP9
BP10
NAME
MAX3658A MAX3658B
MON
MON
GND
GND
N.C.
N.C.
OUT+
OUT-
OUT-
OUT+
N.C.
N.C.
GND
GND
VCC
VCC
IN
IN
FILT
FILT
COORDINATES (µm)
X
Y
16.6
818.6
18.0
543.4
18.0
425.8
16.6
39.4
445.0
39.4
456.2
155.6
455.0
565.8
455.0
818.6
254.6
818.6
135.6
818.6
Figure 8. MON Interface
TOP VIEW
Pin Configuration
VCC 1
IN 2
FILT 3
MON 4
MAX3658
AGP**
8 GND
7 OUT-
6 OUT+
5 GND
Chip Information
TRANSISTOR COUNT: 833
PROCESS: GST-4
TDFN*
(3mm x 3mm)
*THE EXPOSED PAD MUST BE CONNECTED TO CIRCUIT BOARD
GROUND FOR PROPER THERMAL AND ELECTRICAL PERFORMANCE.
**AGP = DEVICE TOPMARK.
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