MAX4402AKA/V-T(2019) 查看數據表（PDF） - Maxim Integrated

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MAX4402AKA/V-T
(Rev.:2019)

Single/Dual/Quad, Low-Cost, Single-Supply, Rail-to-Rail Op Amps with Shutdown

Maxim Integrated 

MAX4400–MAX4403

Single/Dual/Quad, Low-Cost, Single-Supply,

Rail-to-Rail Op Amps with Shutdown

Absolute Maximum Ratings

Power-Supply Voltage (VDD to VSS)........................-0.3V to +6V

All Other Pins................................. (VSS - 0.3V) to (VDD + 0.3V)

Output Short-Circuit Duration

OUT Shorted to VSS or VDD................................. Continuous

Continuous Power Dissipation (TA = +70°C)

5-Pin SC70 (derate 3.10mW/°C above +70°C)...... 246.90mW

5-Pin SOT23 (derate 3.90mW/°C above +70°C)....312.60mW

6-Pin SC70 (derate 3.10mW/°C above +70°C)............245mW

8-Pin SOT23 (derate 5.10mW/°C above +70°C)......408.2mW

8-Pin µMAX (derate 4.5mW/°C above +70°C)............ 362mW

8-Pin SO (derate 5.88mW/°C above +70°C)............... 471mW

14-Pin TSSOP (derate 8.33mW/°C above +70°C). 727.30mW

14-Pin SO (derate 9.10mW/°C above +70°C)............. 667mW

Operating Temperature Range.......................... -40°C to +125°C

Storage Temperature Range............................. -65°C to +150°C

Lead Temperature (soldering, 10s).................................. +300°C

Soldering Temperature (reflow)........................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

5 SC70

PACKAGE CODE

X5+1

Outline Number

21-0076

Land Pattern Number

90-0188

Thermal Resistance, Single-Layer Board:

Junction to Ambient (θJA)

Junction to Case (θJC)

Thermal Resistance, Four-Layer Board:

324°C/W

115°C/W

Junction to Ambient (θJA)

Junction to Case (θJC)

324°C/W

115°C/W

5 SOT23

PACKAGE CODE

Outline Number

Land Pattern Number

Thermal Resistance, Single-Layer Board:

Junction to Ambient (θJA)

Junction to Case (θJC)

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θJA)

Junction to Case (θJC)

21-0057

90-0174

324.30°C/W

82°C/W

255.90°C/W

81°C/W

U5+1

6 SC70

PACKAGE CODE

Outline Number

Land Pattern Number

Thermal Resistance, Single-Layer Board:

Junction to Ambient (θJA)

Junction to Case (θJC)

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θJA)

Junction to Case (θJC)

21-0077

90-0189

326°C/W

115°C/W

326.50°C/W

115°C/W

X6SN+1

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