MAX4718(2002) 查看數據表（PDF） - Maxim Integrated

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MAX4718
(Rev.:2002)

4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP

Maxim Integrated 

4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT

Analog Switches in UCSP

ABSOLUTE MAXIMUM RATINGS

(All Voltages Referenced to GND)

V+, IN_...................................................................-0.3V to +6.0V

COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V)

Continuous Current COM_, NO_, NC_ ...........................±100mA

Peak Current COM_, NO_, NC_

(pulsed at 1ms, 10% duty cycle)................................±200mA

Continuous Power Dissipation (TA = +70°C)

10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW

12-Bump UCSP (derate 11.4mW/°C above +70°C) ....909mW

ESD Method 3015.7 .............................................................>2kV

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Bump Temperature (soldering) (Note 2)

Infrared (15s) ...............................................................+220°C

Vapor Phase (60s) .......................................................+215°C

Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maxi-

mum current rating.

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-

mended in the industry standard specification, JEDEC 020A, paragraph 7.6, table 3 for IR/VPR and convection reflow.

Preheating is required. Hand or wave soldering is not allowed.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS—Single +3V Supply

(V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V,

TA = +25°C, unless otherwise noted.) (Notes 3, 4)

PARAMETER

SYMBOL

CONDITIONS

Analog Signal Range

VCOM_,

VNO_, VNC_

ANALOG SWITCH (Low RON—MAX4717/MAX4718 SPDT 1)

On-Resistance

(Note 5)

RON

V+ = 2.7V, ICOM_ = 10mA;

VNO_ or VNC_ = 1.5V

On-Resistance Match Between

Channels (Notes 5, 6)

∆RON

V+ = 2.7V, ICOM_ = 10mA;

VNO_ or VNC_ = 1.5V

On-Resistance Flatness

(Note 7)

RFLAT(ON)

V+ = 2.7V, ICOM_ = 10mA;

VNO_ or VNC_ = 1.0V, 1.5V, 2.0V

NO_, NC_ Off-Leakage Current

(Note 8)

INO_(OFF), V+ = 3.6V, VCOM_ = 0.3V, 3.3V;

INC_(OFF) VNO_ or VNC_ = 3.3V, 0.3V

COM_ On-Leakage Current

(Note 8)

V+ = 3.6V, VCOM_ = 0.3V, 3.3V;

ICOM_(ON) VNO_ or VNC_ = 0.3V, 3.3V, or

floating

ANALOG SWITCH (High RON—MAX4718 SPDT 2)

On-Resistance (Note 5)

RON

V+ = 2.7V, ICOM_ = 10mA;

VNO_ or VNC_ = 1.5V

TA

TMIN to

TMAX

+25°C

TMIN to

TMAX

+25°C

TMIN to

TMAX

+25°C

TMIN to

TMAX

+25°C

TMIN to

TMAX

+25°C

TMIN to

TMAX

+25°C

TMIN to

TMAX

MIN TYP MAX UNITS

0

V+

V

3.0

4.5

Ω

5

0.1

0.3

Ω

0.4

0.6

1.2

Ω

1.5

-0.5 +0.01 +0.5

nA

-1

+1

-1 +0.01 +1

nA

-2

+2

15

20

Ω

25

2 _______________________________________________________________________________________

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