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AM29LV160DT-70WCE 查看數據表(PDF) - Advanced Micro Devices

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AM29LV160DT-70WCE Datasheet PDF : 49 Pages
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ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combi-
nation) is formed by a combination of the elements below.
Am29LV160D
T -70 E C
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I
= Industrial (–40°C to +85°C)
E = Extended (–55°C to +125°C)
PACKAGE TYPE
E = 48-Pin Thin Small Outline Package (TSOP) Standard Pinout (TS 048)
F = 48-Pin Thin Small Outline Package (TSOP) Reverse Pinout (TSR048)
S = 44-Pin Small Outline Package (SO 044)
WC = 48-ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 8 x 9 mm package (FBC048)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29LV160D
16 Megabit (2M x 8-Bit/1M x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
Valid Combinations For TSOP and SO Packages
Am29LV160DT-70,
Am29LV160DB-70
Am29LV160DT-90,
Am29LV160DB-90
Am29LV160DT-120,
Am29LV160DB-120
EC, EI, EE,
FC, FI, FE,
SC, SI, SE
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
Valid Combinations for FBGA Packages
Order Number
Package Marking
Am29LV160DT-70,
Am29LV160DB-70
Am29LV160DT-90,
Am29LV160DB-90
Am29LV160DT-120,
Am29LV160DB-120
WCC,
WCI,
WCE
L160DT70V,
L160DB70V
L160DT90V,
L160DB90V
L160DT12V,
L160DB12V
C, I, E
8
Am29LV160D

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