MC14490 查看數據表（PDF） - ON Semiconductor

零件编号

产品描述 (功能)

生产厂家

MC14490

Hex Contact Bounce Eliminator

ON Semiconductor 

MC14490

PACKAGE DIMENSIONS

SOIC–16

DW SUFFIX

PLASTIC SOIC PACKAGE

CASE 751G–03

ISSUE B

D

A

q

16

9

1

8

16X B

B

0.25 M T A S B S

14X e

SEATING

PLANE

T

C

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INLCUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS

OF THE B DIMENSION AT MAXIMUM MATERIAL

CONDITION.

MILLIMETERS

DIM MIN MAX

A 2.35 2.65

A1 0.10 0.25

B 0.35 0.49

C 0.23 0.32

D 10.15 10.45

E 7.40 7.60

e

1.27 BSC

H 10.05 10.55

h 0.25 0.75

L 0.50 0.90

q

0_ 7_

http://onsemi.com

11

Share Link: