MPVZ5004G6T1 查看數據表（PDF） - Freescale Semiconductor
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MPVZ5004G6T1
Freescale Semiconductor
MPVZ5004G6T1 Datasheet PDF : 22 Pages
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-A-
5
-B-
8
S
N
J
K
PACKAGE DIMENSIONS
Pressure
D 8 PL
4
0.25 (0.010) M T B S A S
G
1
C
M
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
SURFACE MOUNT
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A 0.415 0.425
B 0.415 0.425
C 0.212 0.230
D 0.038 0.042
G 0.100 BSC
H 0.002 0.010
J 0.009 0.011
K 0.061 0.071
M 0˚
7˚
N 0.405 0.415
S 0.709 0.725
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
5.38 5.84
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚
7˚
10.29 10.54
18.01 18.41
-A-
5
N -B-
8
S
J
K
D 8 PL
4
0.25 (0.010) M T B S A S
G
1
V
C
M
W
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A 0.415 0.425
B 0.415 0.425
C 0.500 0.520
D 0.038 0.042
G 0.100 BSC
H 0.002 0.010
J 0.009 0.011
K 0.061 0.071
M 0˚
7˚
N 0.444 0.448
S 0.709 0.725
V 0.245 0.255
W 0.115 0.125
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
12.70 13.21
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚
7˚
11.28 11.38
18.01 18.41
6.22 6.48
2.92 3.17
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
SURFACE MOUNT
Sensors
Freescale Semiconductor
MPXV5004G
7
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