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AN6846 查看數據表(PDF) - Fairchild Semiconductor

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AN6846 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
AN-6846
APPLICATION NOTE
Printed Circuit Board (PCB) Layout
High-frequency switching current/voltage makes PCB layout
a very important design issue. Good PCB layout minimizes
excessive EMI and helps the power supply survive during
surge/ESD tests.
Guidelines:
ƒ To get better EMI performance and reduce line
frequency ripples, the output of the bridge rectifier
should be connected to capacitor C1 first, then to the
switching circuits.
ƒ The high-frequency current loop is in C1 –
Transformer – MOSFET – RS – C1. The area
enclosed by this current loop should be as small as
possible. Keep the traces (especially 41) short, direct,
and wide. High-voltage traces related to the drain of
MOSFET and RCD snubber should be kept far way
from control circuits to prevent unnecessary
interference. If a heatsink is used for the MOSFET,
connect this heatsink to ground.
ƒ As indicated by 3, the ground of control circuits should
be connected first, then to other circuitry.
ƒ As indicated by 2, the area enclosed by transformer
auxiliary winding, D1, C2, D2, and C3 should also be
kept small. Place C3 close to the SG6846 for good
decoupling.
Two suggestions with different pro and cons for ground
connections are offered:
ƒ GND3 2 4 1: This could avoid common
impedance interference for sense signal.
ƒ GND3214: This could be better for ESD testing
where the earth ground is not available on the power
supply. Regarding the ESD discharge path, the charges
go from secondary through the transformer stray
capacitance to GND2 first. The charges then go from
GND2 to GND1 and back to the mains. Note that
control circuits should not be placed on the discharge
path. Point discharge for common choke can decrease
high-frequency impedance and help increase ESD
immunity.
ƒ Should a Y-cap between primary and secondary be
required, connect this Y-cap to the positive terminal of
C1. If this Y-cap is connected to the primary GND, it
should be connected to the negative terminal of C1
(GND1) directly. Point discharge of this Y-cap also
helps for ESD. However, the creepage between these
two pointed ends should be large enough to satisfy the
requirements of applicable standards.
© 2008 Fairchild Semiconductor Corporation
Rev. 1.3.2 • 9/26/08
Figure 16.Layout Considerations
7
www.fairchildsemi.com

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