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SGR117AK(2015) 查看數據表(PDF) - Microsemi Corporation

零件编号
产品描述 (功能)
生产厂家
SGR117AK
(Rev.:2015)
Microsemi
Microsemi Corporation Microsemi
SGR117AK Datasheet PDF : 6 Pages
1 2 3 4 5 6
Electrical Characteristics (Continued)
Parameter
Minimum Load Current
Current Limit
Temperature Stability (Note 5)
Long Term Stability (Note 5)
RMS Output Noise (% of VOUT)
Test Conditions
(VIN - VOUT) = 40 V
(VIN - VOUT) 15 V
K, IG Packages
T Package
(VIN - VOUT) = 40 V, TJ = 25°C
K, IG Packages
T Package
TA = 125°C, 1000 Hours
TA = 25°C, 10 Hz f 10 kHz (Note 5)
PRE RAD
POST NEUTRON
SGR117A
SGR117A
Min. Typ. Max. Min. Typ. Max.
3.5 5
3.5 8
Units
mA
1.5 2.2
1.5 2.2
A
0.5 0.8
0.5 0.8
A
0.3 0.4
0.3 0.4
A
0.15 0.2
0.15 0.2
A
12
%
0.3 1
%
0.001
%
Note 4. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specification for thermal regulation.
Note 5. These parameters, although guaranteed, are not tested in production.
Connection Diagrams and Ordering Information (See Notes Below)
Package
Part No.
Ambient
Temperature Range
Connection Diagram
3-TERMINAL TO-3
METAL CAN
K-PACKAGE
SGR117AK
SGR117AK-883B
-55°C to 125°C
-55°C to 125°C
ADJUSTMENT
1
2
VIN
CASE IS VOUT
3-PIN TO-39 METAL CAN
T-PACKAGE
SGR117AT
SGR117AT-883B
-55°C to 125°C
-55°C to 125°C
VOUT
2
GND 3
1 VIN
CASE IS GROUND
3-PIN HERMETIC TO-257
IG-PACKAGE (Isolated)
SGR117AIG-883B
SGR117AIG
-55°C to 125°C
-55°C to 125°C
VIN
VOUT
ADJUST
Note 1. Device leads are hot solder dipped with Sn63Pb37 solder.
Note 2. All parts are viewed from the top.
3

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