CF5002LA 查看數據表（PDF） - Nippon Precision Circuits
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CF5002LA Datasheet PDF : 9 Pages
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PAD LAYOUT
(Unit : µm)
VDD
SM5002L series
PINOUT
(Top View)
Q (920,1310)
Y
(0,0) INH XT XT VSS
X
Chip size: 0.92 × 1.31 mm
Chip thickness: 400 ± 30 µm
Chip base: VDD level
INH 1
XT 2
XT 3
VSS 4
8 VDD
7 NC
6 NC
5Q
PIN DESCRIPTION and PAD DIMENSIONS
Number Name
1
INH
2
XT
3
XT
4
VSS
5
Q
6
NC
7
NC
8
VDD
Pad dimensions [µm]
I/O
Description
X
Y
I
Output state control input. Oscillator stopped when LOW. Power-saving pull-up
resistor built in
195
188
I
Amplifier input.
O
Amplifier output.
Crystal oscillator connection pins.
Crystal oscillator connected between XT and XT
385
188
575
188
–
Ground
766
188
O
Output. Output frequency. High impedance at standby operation
765
1159
–
No connection
–
–
–
No connection
–
–
–
Supply voltage
162
1159
BLOCK DIAGRAM
VDD VSS
XT
CG
CD
Rf 1 Cf
XT
Q
Rf 2
INH
RUP1/RUP2
NIPPON PRECISION CIRCUITS—3
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