SM5817PL 查看數據表（PDF） - Micro Commercial Components
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SM5817PL Datasheet PDF : 3 Pages
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MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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SM5817PL
THRU
SM5819PL
Features
• Halogen free available upon request by adding suffix "-HF"
• High-Surge-Capability
• Low Forward Voltage
• Low-Profile-Package
• Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
RoHS Compliant. See ordering information)
Schottky Barrier
Diodes
20 to 40 Volts
Mechanical Data
• Packaging: SOD-123FL
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Marking Code: SM5817PL---K2;SM5818PL---K3 ; SM5819PL---K4
Maximum Ratings
SOD-123FL
A
B
Symbol
V RMS
V RRM
IF(AV)
IFSM
RthJA
RthJC
RthJL
PD
TJ
TSTG
Rating
Maximum RMS Voltage
SM5817PL
SM5818PL
SM5819PL
Repetitive Reverse Voltage SM5817PL
SM5818PL
SM5819PL
Rectified Current (Average) Half Wave
Rectification with Resist. Load at
TL=90OC
Surge Forward Current at ,TL=70OC,8.3ms
Typical Thermal Resistance(Note2)
Power Dissipation
Junction Temperature
Storage Temperature
Rating
14
21
28
20
30
40
1.0
30
88
43
30
1.14
-65 to +125
-65 to +125
Unit
V
V
A
A
OC/W
OC/W
OC/W
W
OC
OC
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol
VF
Parameter
Forward Voltage
(@1A dc)
Min
SM5817PL ---
SM5818PL ---
SM5819PL ---
Typ
0.45
0.56
0.60
Max
---
---
---
Units
V
IR
Leakage Current
@TA=25OC
--- 0.1 ---- mA
C
E
H
D
G
DIMENSIONS
DIM
INCHES
MM
NOTE
MIN MAX MIN MAX
A .140 .152 3.55 3.85
B .100 .122 2.55 3.10
C .055 .075 1.40 1.90
D .035 .047 0.90 1.20
E .020 .041 0.50 1.05
G .010 ----- 0.25 -----
H ----- .010 ---- .25
SUGGESTED SOLDER
PAD LAYOUT
0.093”
@TA=100 OC --- 9.0 ---
mA
Cj
Typical--Junction--Capacitance
@f=1.0MHz,Vr=4V
--- 110 ---
pF
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2. Thermal Resistence : PC Board Mounted on 0.2*0.2"(5*5mm) copper pad area.
0.048”
0.036”
Revision: D
www.mccsemi.com
1 of 3
2013/05/15
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