SPU28N03 查看數據表（PDF） - Infineon Technologies
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SPU28N03 Datasheet PDF : 8 Pages
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SPD 28N03
Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leded
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area2)
Symbol
Values
Unit
min. typ. max.
RthJC
RthJA
RthJA
-
2 K/W
-
- 100
-
-
75
-
-
50
Electrical Characteristics, at Tj = 25 ˚C, unless otherwise specified
Parameter
Symbol
Values
Unit
min. typ. max.
Static Characteristics
Drain- source breakdown voltage
VGS = 0 V, ID = 0.25 mA
Gate threshold voltage, VGS = VDS
ID = 50 µA
Zero gate voltage drain current
VDS = 30 V, VGS = 0 V, Tj = 25 ˚C
VDS = 30 V, VGS = 0 V, Tj = 150 ˚C
V(BR)DSS 30
-
-V
VGS(th)
2.1
3
4
I DSS
µA
0.1
1
-
- 100
Gate-source leakage current
VGS = 20 V, VDS = 0 V
Drain-Source on-state resistance
VGS = 10 V, ID = 28 A
I GSS
RDS(on)
-
10 100 nA
Ω
- 0.014 0.023
1current limited by bond wire
2 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain
connection. PCB is vertical without blown air.
Data Sheet
2
06.99
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