SST39LF200A 查看數據表（PDF） - Microchip Technology

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SST39LF200A

2 Mbit / 4 Mbit / 8 Mbit (x16) Multi-Purpose Flash

Microchip Technology 

A Microchip Technology Company

2 Mbit / 4 Mbit / 8 Mbit Multi-Purpose Flash

SST39LF200A / SST39LF400A / SST39LF800A

SST39VF200A / SST39VF400A / SST39VF800A

Product Ordering Information

Data Sheet

SST 39 VF 200A - 70 - 4C - B3KE

XX XX XXXX - XX - XX - XXXX

Environmental Attribute

E1 = non-Pb

Package Modifier

K = 48 leads or balls

Q = 48 balls or bumps (66 possible posi-

tions)

Package Type

B3 = TFBGA (0.8mm pitch, 6mm x 8mm)

C1 = XFLGA (0.5mm pitch, 4mm x 6mm)

E = TSOP (type 1, die up, 12mm x 20mm)

M1 = WFBGA (0.5mm pitch, 4mm x 6mm)

MA = WFBGA (0.5mm pitch, 4mm x 6mm)

Temperature Range

C = Commercial = 0°C to +70°C

I = Industrial = -40°C to +85°C

Minimum Endurance

4 = 10,000 cycles

Read Access Speed

55 = 55 ns

70 = 70 ns

Version

A = Special Feature Version

Device Density

800 = 8 Mbit

400 = 4 Mbit

200 = 2 Mbit

Voltage

L = 3.0-3.6V

V = 2.7-3.6V

Product Series

39 = Multi-Purpose Flash

1. Environmental suffix “E” denotes non-Pb solder.

SST non-Pb solder devices are “RoHS Compliant”.

©2011 Silicon Storage Technology, Inc.

29

DS25001A

03/11

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