STPS41L30CG-TR 查看數據表（PDF） - STMicroelectronics
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STPS41L30CG-TR Datasheet PDF : 6 Pages
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STPS41L30CG / STPS41L30CT / STPS41L30CR
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values).
IM(A)
300
250
200
150
100
50 IM
0
1.E-03
t
δ=0.5
t(s)
1.E-02
1.E-01
Tc=25°C
Tc=75°C
Tc=125°C
1.E+00
Fig. 6: Relative variation of thermal impedance
junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
0.4 δ = 0.2
0.3 δ = 0.1
0.2
Single pulse
0.1
0.0
1.E-03
1.E-02
tp(s)
T
1.E-01
δ=tp/T
tp
1.E+00
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
IR(mA)
1.E+03
1.E+02
1.E+01
1.E+00
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
1.E-01
1.E-02
0
Tj=25°C
VR(V)
5
10
15
20
25
30
Fig. 8: Junction capacitance versus reverse voltage
applied (typical values).
C(nF)
10.0
F=1MHz
Vosc =30mV
Tj=25°C
1.0
0.1
1
VR(V)
10
100
Fig. 9: Forward voltage drop versus forward current.
IFM(A)
100
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
10
Tj=25°C
(Maximum values)
VFM(V)
1
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Fig. 10: Thermal resistance junction to ambient ver-
sus copper surface under tab (epoxy printed board
FR4, Cu = 35µm) (STPS41L30CG only).
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
0
0
S(cm²)
5
10
15
20
25
30
35
40
3/6
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