TC04BCZM 查看數據表（PDF） - TelCom Semiconductor, Inc

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TC04BCZM

LOW POWER, BANDGAP VOLTAGE REFERENCES

TelCom Semiconductor, Inc 

TC04A

TC04B

TC05A

TC05B

LOW POWER, BANDGAP

VOLTAGE REFERENCES

ABSOLUTE MAXIMUM RATINGS*

Forward Current .................................................... +10mA

Reverse Current .................................................... +30mA

Storage Temperature Range ................ – 65°C to +150°C

Operating Temperature Range

TO-92 Package ..................................... 0°C to +70°C

Surface Mount Package ........................ 0°C to +70°C

Lead Temperature (Soldering, 10 sec)

TO-92 Package .............................................. +300°C

Surface Mount Package ................................. +300°C

Power Dissipation ............................. Limited by Forward/

Reverse Current

*Functional operation above the absolute maximum stress ratings is not

implied.

ELECTRICAL CHARACTERISTICS: TA = +25°C, unless otherwise specified.

Symbol

Parameter

Test Conditions

Min

VBR

DVBR

TC

IR

Reverse Breakdown Voltage:

TC04

TC05

Reverse Breakdown Voltage Change:

TC04

TC05

Temperature Coefficient:

TC04A/TC05A

TC04B/TC05B

Reverse Current:

TC04

TC05

IR = 100µA

15µA < IR < 20mA

20µA < IR < 1mA

20µA < IR < 20mA

25µA < IR < 1mA

IR = 100µA

1.24

2.45

—

—

—

—

—

—

0.015

0.020

Typ

1.26

2.50

10

0.25

10

0.25

0.003

0.003

—

—

Max Unit

1.28

V

2.60

20

mV

1

20

1

0.005 %/°C

0.01

20

mA

20

3-6

TELCOM SEMICONDUCTOR, INC.

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