ULN2069B 查看數據表（PDF） - STMicroelectronics

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ULN2069B

80 V - 1.5 A QUAD DARLINGTON SWITCHES

STMicroelectronics 

ULN2065B-ULN2067B-ULN2069B-ULN2071B-ULN2075B-ULN2077B

MOUNTING INSTRUCTIONS

The Rth j-amb can be reduced by soldering the GND

pins to a suitable copper area of the printed circuit

board (Fig. 12) or to an external heatsink (Fig. 13).

The diagram of figure 14 shows the maximum dis-

sipable power Ptot and the Rth j-amb as a function of

the side ”∝” of two equal square copper areas hav-

ing a thickness of 35 µ (1.4 mils).

Figure 12 : Example of P.C. Board Area which is

Used as Heatsink.

During soldering the pins temperature must not ex-

ceed 260 °C and the soldering time must not be

longer than 12 seconds.

The external heatsink or printed circuit copper area

must be connected to electrical ground.

Figure 13 : External Heatsink Mounting Example.

Figure 14 : Maximum Dissipable Power and Junc-

tion to Ambient Thermal Resistance

vs. Side ”I”.

Figure 15 : Maximum Allowable Power Dissipa-

tion vs. Ambient Temperature.

5/7

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