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UPC1060C 查看數據表(PDF) - NEC => Renesas Technology

零件编号
产品描述 (功能)
生产厂家
UPC1060C
NEC
NEC => Renesas Technology NEC
UPC1060C Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
µ PC1060
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to
consult with our sales offices.
For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (C10535E).
Type of Through-hole Device
µ PC1060C : 8-pin plastic DIP (7.62 mm (300))
Process
Conditions
Wave soldering (only to leads)
Solder temperature: 260°C or below, Flow time: 10 seconds or less.
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
REFERENCE DOCUMENTS
Semiconductor Device Mounting Technology Manual
Semiconductor Selection Guide -Products and Packages-
C10535E
X13769X
6
Data Sheet G14607EJ4V0DS00

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