CM6100 查看數據表（PDF） - ON Semiconductor

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CM6100

0.4mm Pitch Daisy Chain

ON Semiconductor 

CM6100

Mechanical Specification

CSP-4 Mechanical Specifications

The CM6100 is supplied in a 4 bump Chip Scale Package (CSP).

PACKAGE DIMENSIONS

Controlling dimension: millimeters

Package

Bumps

Custom CSP

4

Millimeters

Dim

Inches

Min Nom Max Min Nom Max

A1 0.755 0.800 0.845 0.0297 0.0315 0.0333

A2 0.755 0.800 0.845 0.0297 0.0315 0.0333

B1 0.395 0.400 0.405 0.0156 0.0157 0.0159

B2 0.395 0.400 0.405 0.0156 0.0157 0.0159

C1 0.150 0.200 0.250 0.0059 0.0079 0.0098

C2 0.150 0.200 0.250 0.0059 0.0079 0.0098

D1 0.570 0.600 0.630 0.0224 0.0236 0.0248

D2 0.394 0.406 0.418 0.0155 0.0160 0.0165

BOTTOM VIEW

A1

C1

B1

A

B

21

0.27 DIA.

D1

SOLDER BUMPS

D2

SIDE

VIEW

DIMENSIONS IN MILLIMETERS

Package Dimensions for

CM6100 Chip Scale Package

Rev. 6 | Page 4 of 6 | www.onsemi.com

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