FH23-15S-0.3SHW(2004) 查看數據表（PDF） - HIROSE ELECTRIC

零件编号

产品描述 (功能)

生产厂家

FH23-15S-0.3SHW
(Rev.:2004)

0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors

HIROSE ELECTRIC 

BRecommended Temperature Profile

qUsing Typical Solder Paste

250

200

150

(ç)

100

50

0

150ç

160ç

5 sec. Max.

240ç

200ç

25ç(60 sec.)

(30 sec.) (20 sec.

60 sec. to 90 sec.

to 30 sec.)

Start

60 Preheating 120

Time (Seconds)

Soldering

HRS test conditions

Solder method

:Reflow, IR/hot air

(Nihon Den-netsu Co., Ltd.’s

Part Number: SENSBY NR-2)

Environment

:Room air

Solder composition :Paste, 63%Sn/37%Pb

(Senju Metal Industry, Co., Ltd.’s

Part Number: OZ63-201C-50-9)

Test board

:Glass epoxy 45mm∞100mm∞1.6mm thick

Land dimensions :Lead type 0.3mm∞1.25mm,

0.3mm∞0.7mm

Leadless type 0.3mm∞1.25mm,

0.3mm∞0.65mm

Metal mask

:Lead type

0.25mm∞1.25mm∞0.1mm thick

0.25mm∞0.7mm∞0.1mm thick

Leadless type

0.25mm∞1.25mm∞0.1mm thick

0.25mm∞0.65mm∞0.1mm thick

This temperature profile is based on the above conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and board

size/thickness. Consult your solder paste and equipment

manufacturer for specific recommendations.

qUsing Lead-free Solder paste

250

200

200ç

Max. 250ç

230ç

150

(ç)

100

150ç

50

25ç (60 sec.) 90 sec. to 120 sec.

(60 sec.)

0

Start

60 Preheating 120 Soldering

Time (Seconds)

HRS test condition

Solder method

Environment

Solder composition

Test board

Land dimensions

Metal mask

:Reflow, IR/hot air

(Nihon Den-netsu Co., Ltd.’s

Part Number: SENSBY NR-2)

:Room air

:Paste, 96.5%Sn/3.0%Ag/0.5%Cu

(Senju Metal Industry, Co., Ltd.’s

Part Number: M705-221CM5-42-10.5)

:Glass epoxy 45mm∞100mm∞1.6mm thick

: Lead type 0.3mm∞1.25mm,

0.3mm∞0.7mm

Leadless type 0.3mm∞1.25mm,

0.3mm∞0.65mm

: Lead type

0.25mm∞1.25mm∞0.1mm thick

0.25mm∞0.7mm∞0.1mm thick

Leadless type

0.25mm∞1.25mm∞0.1mm thick

0.25mm∞0.65mm∞0.1mm thick

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and board

size/thickness. Consult tour solder paste and equipment

manufacturer for specific recommendations.

8

Share Link: