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FH23-15S-0.3SHAW 查看數據表(PDF) - HIROSE ELECTRIC

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FH23-15S-0.3SHAW Datasheet PDF : 11 Pages
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BRecommended Temperature Profile
qUsing Conventional Solder Paste
5 sec. Max.
250
240ç
200
150
(ç)
100
150ç
160ç
200ç
50
25ç(60 sec.)
(30 sec.) (20 sec.
60 sec. to 90 sec.
to 30 sec.)
0
Preheating
Soldering
Start
60
120
Time (Seconds)
Recommended Conditions
Reflow system
:IR reflow
Solder
:Paste type 63 Sn/37 Pb
(Flux content 11 wt%)
Test board
: Glass epoxy 45mm x 100mm x 1.6mm
Metal mask thickness : 0.1 mm
Recommended temperature profile.
The temperature may be slightly changed according to the solder
paste type and thickness.
qUsing Lead-free Solder paste
250
200
200ç
Max. 250ç
230ç
150
(ç)
100
150ç
50
25ç (60 sec.) 90 sec. to 120 sec.
(60 sec.)
Preheating
Soldering
0
Start
60
120
Time (Seconds)
Recommended Conditions
Reflow system
:IR reflow
Solder
:Paste type Sn/0.3 Ag/0.5 Cu
(Flux content 11 wt%)
Test board
:Glass epoxy 45mm x 100mm x 1.6 mm
Metal mask thickness :0.1 mm
Recommended temperature profile.
The temperature may be slightly changed according to the solder
paste type and thickness.
62

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