FH23-15S-0.3SHAW 查看數據表（PDF） - HIROSE ELECTRIC

零件编号

产品描述 (功能)

生产厂家

FH23-15S-0.3SHAW

0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors

HIROSE ELECTRIC 

BFH23 Series FPC Construction (Recommended Specifications)

1. Using Single-sided FPC

Material Name

Material

Thickness (µm)

Covering film layer.

Polyamide 1 mil thick.

25

Cover adhesive

25

Surface treatment

Tinned copper plating or pure tin plating

5

Copper foil

Cu

1oz

35

Base adhesive

25

Base film

Polyamide 1 mil thick

25

Reinforcement material adhesive Heat-hardened adhesive

30

Stiffener

Polyamide 3 mil thick

75

Total

195

2. Using Double-sided FPC

Material Name

Material

Thickness (µm)

Covering layer film

Polyamide 1 mil thick

25

Cover adhesive

25

Surface treatment

Tinned copper plating or pure tin plating

5

Through-hole copper

Cu

15

Copper foil

Cu

1/2oz

18

Base adhesive

18

Base film

Polyamide 1 mil thick

25

Base adhesive

18

Copper foil

Cu

1/2oz

18

Cover adhesive

25

Covering layer film

Polyamide 1 mil thick

25

Reinforcement material adhesive Heat-hardened adhesive

25

Stiffener

Polyamide 1 mil thick

25

Total

199

3. Precautions

Note : Recommended specification for FPC 0.2±0.03 mm thick.

FPC/FFC Manufactures' Contact List

Sumitomo Bakelite Co., Ltd. Flexible Printed Circuit Board Division

5-8, Higashi-shinagawa 2-chome, Shinagawa-ku, Tokyo, Japan

Fujikura Ltd. Electronics Global Marketing Department

1-5-1, Kiba, Koto-ku, Tokyo, Japan

NOK Corporation Sales Division Overseas Business Department

1-12-15, Shiba-Daimon, Minato-ku, Tokyo, Japan

TEL:+81 3 5462 4191

FAX:+81 3 5462 4882

TEL:+81 3 5606 1165

FAX:+81 3 5606 1530

TEL:+81 3 3432 6976/8415

FAX:+81 3 3432 3919

63

Share Link: