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KM416C1000B-5 查看數據表(PDF) - Samsung

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KM416C1000B-5 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
KM416C1000B, KM416C1200B
KM416V1000B, KM416V1200B
CMOS DRAM
10. tASC, tCAH are referenced to the earlier CAS rising edge.
11. tCP is specified from the last CAS rising edge in the previous cycle to the first CAS falling edge in the next cycle.
12. tCWD is referenced to the later CAS falling edge at word read-modify-write cycle.
13. tCWL is specified from W falling edge to the earlier CAS rising edge.
14. tCSR is referenced to earlier CAS falling low before RAS transition low.
15. tCHR is referenced to the later CAS rising high after RAS transition low.
RAS
LCAS
UCAS
tCSR
tCHR
16. tDS, tDH is independently specified for lower byte DIN(0-7), upper byte DIN(8-15)
17. 4096(4K Ref.)/1024(1K Ref.) of burst refresh must be executed within 16ms before and after self-refresh in order to meet
refresh specification (L-version).

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