MAX3873A 查看數據表（PDF） - Maxim Integrated

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MAX3873A

Low-Power, Compact 2.5Gbps/2.7Gbps Clock-Recovery and Data-Retiming IC

Maxim Integrated 

Low-Power, Compact 2.5Gbps or 2.7Gbps

Clock-Recovery and Data-Retiming IC

Sinusoidal Jitter Tolerance and

Input Deterministic Jitter Trade-Offs

The MAX3873A has excellent jitter tolerance. Adding DJ

to the input will close the eye opening and result in

reduced sinusoidal jitter tolerance. It typically can toler-

ate more than 0.3UIP-P of 10MHz jitter when measured

with a 223 - 1 PRBS data stream with 0.4UI of determin-

istic jitter (DJ). This gives a total high-frequency jitter tol-

erance of 0.7UI. Refer to the Jitter Tolerance vs.

Pulse-Width Distortion and Jitter Tolerance vs.

Deterministic Jitter graphs in the Typical Operating

Characteristics section.

Input and Output Terminations

The MAX3873A’s digital CML outputs (SDO+, SDO-,

SCLKO+, SCLKO-) have selectable output amplitude

controlled by the MODE input. If the SCLKO outputs

are not used, they can be disabled (see the Supply

Current vs. Temperature graph in the Typical Operating

Characteristics section).

The structure of the high-speed digital outputs is shown

in Figure 8. The MODE input sets the current in the cur-

rent source, thereby controlling the output swing. The

SCLKEN input sets the current in the SCLKO current

source to 0mA, disabling the output.

The structure of the CML inputs (SDI±) is shown in Figure

9. Unless the CML input is DC-coupled to a CML output,

use AC-coupling with the CML inputs to avoid upsetting

the common-mode voltage.

Applications Information

Consecutive Identical Digits (CID)

The MAX3873A has a low phase and frequency drift in

the absence of data transitions. As a result, long runs of

consecutive zeros and ones can be tolerated while

maintaining a BER of less than 10-10. The CID tolerance

is tested using a 213 - 1 PRBS, substituting a long run

of zeros to simulate the worst case. A CID tolerance of

2000 bits is typical.

Exposed-Pad Package

The exposed-pad (EP), 20-pin QFN incorporates fea-

tures that provide a very low thermal-resistance path for

heat removal from the IC. The pad is electrical ground

on the MAX3873A and must be soldered to the circuit

board for proper thermal and electrical performance.

Layout

Circuit board layout and design can significantly affect

the MAX3873A’s performance. Use good high-frequency

design techniques, including minimizing ground induc-

tance and using controlled-impedance transmission

lines on the data and clock signals. Place power-supply

decoupling as close to the VCC pins as possible. Isolate

the input from the output signals to reduce feedthrough.

MAX3873A

VCC

50Ω

50Ω

OUT+

VCC

VCC

50Ω

SDI+

SCLKO ONLY

OUT-

MODE

SCLKEN

VCC

50Ω

SDI-

MAX3873A

Figure 8. CML Output Model

Figure 9. CML Input Model

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