MAX9643 查看數據表（PDF） - Maxim Integrated

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MAX9643

60V High-Speed Precision Current-Sense Amplifier

Maxim Integrated 

MAX9643

60V High-Speed Precision Current-Sense Amplifier

Absolute Maximum Ratings

RS+ to GND, RS- to GND (Note 1)........................-3.5V to +65V

RS+ to RS-........................................................................... ±15V

VCC to GND............................................................-0.3V to +40V

VCC > 4.5V

OUT to GND......................................................-0.3V to +4.5V

VEE to GND.........................................................+0.3V to -5V

CP1 to GND......................................................-0.3V to +4.5V

VCC ≤ 4.5V

OUT to GND......................................... -0.3V to (VCC + 0.3V)

VEE to GND....................................... +0.3V to (-VCC + 0.3V)

CP1 to GND......................................... -0.3V to (VCC + 0.3V)

CP2 to GND .............................................. (VEE - 0.3V) to +0.3V

Short-Circuit Duration.................................................Continuous

Continuous Input Current into Any Pin..............................±20mA

ESD on RS+, RS-........................................................±4kV HBM

ESD on All Other Pins.................................................±2kV HBM

Maximum Power Dissipation

TDFN-EP (derate 16.7mW/°C at +70°C).................1333.3mW

Operating Temperature Range......................... -40°C to +125°C

Junction Temperature.......................................................+150°C

Lead Temperature (10s, soldering)...................................+300°C

Soldering Temperature (reflow)........................................+260°C

Note 1: Voltages below -3.5V are allowed, as long as the input current is limited to 5mA by an external resistor.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics (Note 2)

TDFN

Junction-to-Ambient Thermal Resistance (θJA)...........60°C/W

Junction-to-Case Thermal Resistance (θJC)................11°C/W

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics

(VCC = 5V, VRS+ = VRS- = 12V, TA = -40°C to +125°C, unless otherwise noted.) (Note 3)

PARAMETER

DC CHARACTERISTICS

Input Common-Mode Voltage

Range

Input Offset Voltage (Notes 4, 5)

Common-Mode Rejection Ratio

(Note 5)

CMRR vs. Frequency (Note 5)

Input Bias Current

Input Bias Current, VCC = 0V,

VRS+ = VRS- = 60V

Input Offset Current (Note 6)

SYMBOL

CONDITIONS

VCC ≥ 5V, guaranteed by CMRR test,

VRS+, VRS-

VSENSE ≤ 100mV

VCC < 5V, guaranteed by CMRR test,

VSENSE ≤ 100mV

TA = +25°C

VOS -40°C < TA < +125°C

+10°C < TA < +85°C

CMRR

-1.5V ≤ VCM ≤ 60V, TA = +25°C

-1.5V ≤ VCM ≤ 60V, -40°C ≤ TA ≤ +125°C

AC CMRR f = 100kHz

IRS+, IRS-

TA = +25°C

-40°C < TA < +125°C

IRS+, IRS

TA = +25°C

IRS+ - IRS- +10°C < TA < +85°C

-40°C < TA < +125°C

MIN TYP MAX UNITS

-1.5

+60

3.5 -

VCC

V

60

10

130

650

µV

400

120 130

dB

110

90

dB

35

60

µA

60

25

µA

0.02 0.65

0.65

µA

0.8

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