MAX9736 查看數據表（PDF） - Maxim Integrated
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MAX9736 Datasheet PDF : 25 Pages
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Mono/Stereo High-Power Class D Amplifier
ABSOLUTE MAXIMUM RATINGS
PVDD to PGND.......................................................-0.3V to +30V
AGND to PGND .....................................................-0.3V to +0.3V
INL, INR, FBL, FBR, COM to AGND .........-0.3V to (VREG + 0.3V)
MUTE, SHDN, MONO, MOD, REGEN to AGND.......-0.3V to +6V
REG to AGND ..............................................-0.3V to (VS + 0.3V)
VS to AGND (Note 1)................................................-0.3V to +6V
OUTL+, OUTL-, OUTR+,
OUTR-, to PGND...................................-0.3V to (PVDD + 0.3V)
C1N to PGND ..........................................-0.3V to (PVDD + 0.3V)
C1P to PGND ...........................(PVDD - 0.3V) to (VBOOT + 0.3V)
BOOT to PGND ..............................(VC1P - 0.3V) to PVDD + 12V
OUTL+, OUTL-, OUTR+, OUTR-,
Short Circuit to PGND or PVDD...............................Continuous
Thermal Limits (Notes 2, 3)
Continuous Power Dissipation (TA = +70°C)
32-Pin TQFN 5mm x 5mm Multiple Layer PCB
(derate 34.5mW/°C above +70°C) ..................................2.76W
θJA .................................................................................29°C/W
θJC ...................................................................................2°C/W
Continuous Power Dissipation (TA = +70°C)
32-Pin TQFN 7mm x 7mm Multiple Layer PCB
(derate 37mW/°C above +70°C) .....................................2.96W
θJA .................................................................................27°C/W
θJC ...................................................................................1°C/W
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: VS cannot exceed PVDD + 0.3V. See the Power Sequencing section.
Note 2: Thermal performance of this device is highly dependant on PCB layout. See the Applications Information section for more details.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, visit www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VPVDD = 20V, VVS = 5V, VAGND = VPGND = 0V, VMOD = VSHDN = VMUTE = 5V, REGEN = MONO = AGND, C1 = 0.1μF, C2 = 1μF,
RIN_ = 20kΩ and RFB_= 20kΩ, RL = ∞, AC measurement bandwidth 22Hz to 22kHz, TA = TMIN to TMAX, unless otherwise noted.
Typical values are at TA = +25°C.) (Notes 4, 5)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
AMPLIFIER DC CHARACTERISTICS
Speaker Supply Voltage Range
PVDD Inferred from PSRR test
8
28
V
Preamplifier Supply Voltage
Range
VS
(Notes 1 and 7)
4.5
5.5
V
Undervoltage Lockout
UVLO
7
V
Quiescent Supply Current
IPVDD
IVS
RL = ∞, VREGEN = 5V,
VVS = open
RL = ∞, VREGEN = 0V,
VVS = 5V
TA = +25°C
TA = TMIN to TMAX
TA = +25°C
TA = TMIN to TMAX
30
45
mA
50
14
20
mA
22
Shutdown Supply Current
ISHDN VSHDN = 0V
IPVDD
IVS
1
10
μA
10
REG Voltage
VREG
4.2
V
Preregulator Voltage
VS
Internal regulated 5V, VREGEN = 5V
4.8
V
COM Voltage
VCOM
1.9
2.05
2.2
V
INPUT AMPLIFIER CHARACTERISTICS
Capacitive Drive
Output Swing (Note 6)
CL
Sinking ±1mA
30
pF
±2
V
Open-Loop Gain
AVO
VFB_ = VCOM ±500mV, RFB_= 20kΩ to IN_
88
dB
Input Offset Voltage
VOS
±1
mV
2 _______________________________________________________________________________________
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