MF1PLUS6001DA4/03 查看數據表（PDF） - NXP Semiconductors.

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MF1PLUS6001DA4/03

Mainstream contactless smart card IC for fast and easy solution development

NXP Semiconductors. 

NXP Semiconductors

Table 2. Ordering information …continued

Type number

Package

Commercial

name

Name

MF1PLUS8001DA4/13 MOA4

PLLMC

MF1PLUS6001DUD/13 FFC

-

MF1PLUS6001DA4/13 MOA4

6. Block diagram

PLLMC

MF1PLUSx0y1

Mainstream contactless smart card IC

Description

Version

plastic leadless module carrier package; 35 mm SOT500-2

wide tape, 4 kB EEPROM, 7-byte UID, no

security level 1 or 2, L3 card

8 inch wafer (sawn; 120 µm thickness, on film -

frame carrier; electronic fail die marking

according to SECS-II format) see Ref. 3,

2 kB EEPROM, 7-byte UID, no security level 1 or

2, L3 card

plastic leadless module carrier package; 35 mm SOT500-2

wide tape, 2 kB EEPROM, 7-byte UID, no

security level 1or 2, L3 card

RF

INTERFACE

SECURITY

SENSORS

POWER ON

RESET

VOLTAGE

REGULATOR

CLOCK

INPUT FILTER

RESET

GENERATOR

UART

ISO/IEC

14443A

Fig 1. Block diagram

AES CRYPTO

CO-PROCESSOR

TRUE RANDOM

NUMBER

GENERATOR

CRYPTO1

CPU/LOGIC UNIT

CRC

ROM

RAM

EEPROM

001aah389

MF1PLUSX0Y1_SDS

Product short data sheet

PUBLIC

All information provided in this document is subject to legal disclaimers.

Rev. 3.2 — 21 February 2011

163532

© NXP B.V. 2011. All rights reserved.

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