NCP51460 查看數據表（PDF） - ON Semiconductor

零件编号

产品描述 (功能)

生产厂家

NCP51460

Micropower Precision Voltage Reference

ON Semiconductor 

NCP51460

The peaks which are visible on the noise spectrum are

reflecting the stability of the NCP51460 device. In the

comparison in Figure 31 it can be noticed that 0 mF and

10 mF cases represents the best stability.

Thermal Characteristics

As power dissipation in the NCP51460 increases, it may

become necessary to provide some thermal relief. The

maximum power dissipation supported by the device is

dependent upon board design and layout. The board material

and the ambient temperature affect the rate of junction

temperature rise for the part. The maximum power

dissipation the NCP51460 can handle is given by:

PD(MAX)

+

[TJ(MAX) *

RqJA

TA]

(eq. 1)

Since TJ is not recommended to exceed 100°C (TJ(MAX)),

then the NCP51460 can dissipate up to 305 mW when the

ambient temperature (TA) is 25°C.

The power dissipated by the NCP51460 can be calculated

from the following equations:

PD [ VIN(IQ@IOUT) ) IOUT(VIN * VOUT) (eq. 2)

or

VIN(MAX)

[

PD(MAX) ) (VOUT

IOUT ) IQ

@

IOUT)

(eq. 3)

PCB Layout Recommendations

VIN and GND printed circuit board traces should be as

wide as possible. When the impedance of these traces is

high, there is a chance to pick up noise and cause the

regulator to malfunction. Place external components,

especially the output capacitor, as close as possible to the

NCP51460, and make traces as short as possible.

ORDERING INFORMATION

Device

Marking Code

Package

Shipping†

NCP51460SN33T1G

46A

SOT−23

3,000 / Tape & Reel

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specification Brochure, BRD8011/D.

www.onsemi.com

10

Share Link: