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PMXB360ENEA 查看數據表(PDF) - NXP Semiconductors.

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产品描述 (功能)
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PMXB360ENEA
NXP
NXP Semiconductors. NXP
PMXB360ENEA Datasheet PDF : 15 Pages
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NXP Semiconductors
PMXB360ENEA
80 V, N-channel Trench MOSFET
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDS
drain-source voltage
Tj = 25 °C
VGS
gate-source voltage
ID
drain current
VGS = 10 V; Tamb = 25 °C
[1]
VGS = 10 V; Tamb = 100 °C
[1]
IDM
peak drain current
Tamb = 25 °C; single pulse; tp ≤ 10 µs
EDS(AL)S
non-repetitive drain-source
avalanche energy
Tj(init) = 25 °C; ID = 0.17 A; DUT in
avalanche (unclamped)
Ptot
total power dissipation
Tamb = 25 °C
[2]
[1]
Tsp = 25 °C
Tj
junction temperature
Tamb
ambient temperature
Tstg
storage temperature
Source-drain diode
IS
source current
Tamb = 25 °C
[1]
ESD maximum rating
VESD
electrostatic discharge voltage HBM
[3]
Min Max Unit
-
80
V
-20 20
V
-
1.1 A
-
0.7 A
-
4.4 A
-
7.1 mJ
-
400 mW
-
1070 mW
-
6250 mW
-55 150 °C
-55 150 °C
-65 150 °C
-
0.8 A
-
2000 V
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
drain 6 cm2.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] Measured between all pins.
PMXB360ENEA
Product data sheet
All information provided in this document is subject to legal disclaimers.
16 September 2013
© NXP N.V. 2013. All rights reserved
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