BAS40(2008) 查看數據表（PDF） - Diodes Incorporated.

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BAS40
(Rev.:2008)

SURFACE MOUNT SCHOTTKY BARRIER DIODE

Diodes Incorporated. 

Features

• Low Forward Voltage Drop

• Fast Switching

• PN Junction Guard Ring for Transient and ESD Protection

• Lead, Halogen and Antimony Free, RoHS Compliant

"Green" Device (Notes 3 and 4)

• Qualified to AEC-Q101 Standards for High Reliability

BAS40 /-04 /-05 /-06

SURFACE MOUNT SCHOTTKY BARRIER DIODE

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Mechanical Data

• Case: SOT-23

• Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020D

• Terminals: Solderable per MIL-STD-202, Method 208

• Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

• Polarity: See Diagrams Below

• Marking Information: See Page 2

• Ordering Information: See Page 2

• Weight: 0.008 grams (approximate)

Top View

BAS40

BAS40-04

BAS40-05

BAS40-06

Maximum Ratings @TA = 25°C unless otherwise specified

Characteristic

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

Forward Continuous Current (Note 1)

Forward Surge Current (Note 1)

@ t < 1.0s

Symbol

VRRM

VRWM

VR

IFM

IFSM

Value

40

200

600

Unit

V

mA

mA

Thermal Characteristics

Characteristic

Power Dissipation (Note 1)

Thermal Resistance, Junction to Ambient Air (Note 1)

Operating Temperature Range

Storage Temperature Range

Symbol

PD

RθJA

TJ

TSTG

Value

350

357

-55 to +125

-65 to +150

Unit

mW

°C/W

°C

°C

Electrical Characteristics @TA = 25°C unless otherwise specified

Characteristic

Reverse Breakdown Voltage (Note 2)

Forward Voltage

Reverse Leakage Current (Note 2)

Total Capacitance

Reverse Recovery Time

Symbol Min Typ

V(BR)R

40

⎯

VF

⎯

⎯

IR

⎯ 20

CT

⎯ 4.0

trr

⎯

⎯

Max

⎯

380

1000

200

5.0

5.0

Unit

Test Condition

V IR = 10μA

mV tp < 300μs, IF = 1.0mA

tp < 300μs, IF = 40mA

nA tp < 300μs, VR = 30V

pF VR = 0V, f =1.0MHz

ns IF = IR = 10mA to IR = 1.0mA,

RL = 100Ω

Notes:

1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. Short duration pulse test used to minimize self-heating effect.

3. No purposefully added lead. Halogen and Antimony Free.

4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code

V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

BAS40 /-04 /-05 /-06

Document number: DS11006 Rev. 21 - 2

1 of 3

www.diodes.com

July 2008

© Diodes Incorporated

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