Package and PCB thermal data
3
Package and PCB thermal data
3.1
SO-8 thermal data
Figure 27. SO-8 PC board
VN750SMP-E
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: 0.14 cm2, 2 cm2).
Figure 28. Rthj-amb vs PCB copper area in open box free air condition
RTHj_amb (ºC/W) SO-8 at 2 pins connected to TAB
110
105
100
95
90
85
80
75
70
0
0.5
1
1.5
2
2.5
PCB Cu heatsink area (cm^2)
20/27
Doc ID 16812 Rev 1