AD8231-EP 查看數據表（PDF） - Analog Devices
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AD8231-EP Datasheet PDF : 20 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Output Short-Circuit Current
Input Voltage (Common-Mode)
Differential Input Voltage
Storage Temperature Range
Operational Temperature Range
Package Glass Transition Temperature
ESD (Human Body Model)
ESD (Charged Device Model)
ESD (Machine Model)
Rating
6V
Indefinite1
−VS − 0.3 V to +VS + 0.3 V
−VS − 0.3 V to +VS + 0.3 V
–65°C to +150°C
–55°C to +125°C
130°C
1.5 kV
1.5 kV
0.2 kV
1 For junction temperatures between 105°C and 130°C, short-circuit operation
beyond 1000 hours can impact part reliability.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD8231-EP
THERMAL RESISTANCE
Table 5.
Thermal Pad
Soldered to Board
Not Soldered to Board
θJA
Unit
54
°C/W
96
°C/W
The θJA values in Table 5 assume a 4-layer JEDEC standard
board. If the thermal pad is soldered to the board, it is
also assumed it is connected to a plane. θJC at the exposed pad
is 6.3°C/W.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8231-EP is
limited by the associated rise in junction temperature (TJ) on
the die. At approximately 130°C, which is the glass transition
temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit may change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the amplifiers. Exceeding a
temperature of 130°C for an extended period can result in a loss
of functionality.
ESD CAUTION
Rev. A | Page 7 of 20
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