T2035-600G-TR 查看數據表（PDF） - STMicroelectronics
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T2035-600G-TR Datasheet PDF : 5 Pages
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T2035-600G
Fig. 7: Non repetitive surge peak on-state current
for a sinusoidal pulse with width tp<10ms, and cor-
responding value of I2t.
ITSM(A),I t(A s)
1000
500
ITSM
Tj initial=25°C
Fig. 8: On-state characteristics(maximum values).
ITM(A)
200
100
Tj max.:
Vto=0.87V
Rt=20 mΩ
Tj=Tj max.
It
200
100
1
tp(ms)
2
5
10
Fig. 9: Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxyprinted circuit
board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm )
0
0 4 8 12 16 20 24 28 32 36 40
10
Tj=25°C
VTM(V)
1
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Fig. 10: Typical reflow soldering heat profile, either
for mounting on FR4 or metal-backed boards.
T (°C)
250
200
245°C
215°C
150
Epoxy FR4
board
100
50
0
0
Metal-backed
board
t (s)
40 80 120 160 200 240 280 320 360
4/5
®
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