SK100E111(2001) 查看數據表（PDF） - Semtech Corporation
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SK100E111 Datasheet PDF : 6 Pages
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HIGH-PER.ORMANCE PRODUCTS
Package Information
–N–
PIN De–sL–criptions
Y BRK
D
W
D
V
28
1
A 0.007 (0.180) M T L – M S N S
Z
R 0.007 (0.180) M T L – M S N S
C
E
G
G1
0.010 (0.250) S T L – M S N S
0.004 (0.100)
J –T– SEATING PLANE
VIEW S
SK10/100E111
NOTES:
1. Datums –L–, –M–, and –N– determined where top of
lead shoulder exits plastic body at mold parting line.
2. DIM G1, true position to be measured at Datum –T–,
Seating Plane.
3. DIM R and U do not include mold flash. Allowable
mold flash is 0.010 (0.250) per side.
4. Dimensioning and tolerancing per ANSI Y14.5M,
1982.
5. Controlling Dimension: Inch.
6. The package top may be smaller than the package
bottom by up to 0.012 (0.300). Dimensions R and U
are determined at the outermost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate
burrs and interlead flash, but including any mismatch
betweeen the top and bottom of the plastic body.
7. Dimension H does not include Dambar protrusion or
intrusion. The Dambar protrusion(s) shall not cause
the H dimension to be greater than 0.037 (0.940).
The Dambar intrusion(s) shall not cause the H
dimension smaller than 0.025 (0.635).
B
0.007 (0.180) M T L - M S N S
U
Z
0.007 (0.180) M T L - M S N S
+
+
X
G1
0.010 (0.250) S T L - M S N S
H
0.007(0.180) M T L – M S N S
K1
K
F 0.007 (0.180) M T L – M S N S
VIEW S
Revision 1 /.ebruary 13, 2001
3
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A
0.485 0.495 12.32 12.57
B
0.485 0.495 12.32 12.57
C
0.165 0.180 4.20 4.57
E
0.090 0.110 2.29 2.79
.
0.013 0.019 0.33 0.48
G
0.050 BSC
1.27 BSC
H
0.026 0.032 0.66 0.81
J
0.020
--
0.51
--
K
0.025
--
0.64
--
R
0.450 0.456 11.43 11.58
U
0.450 0.456 11.43 11.58
V
0.042 0.048 1.07 1.21
W
0.042 0.048 1.07 1.21
X
0.042 0.056 1.07 1.42
Y
--
0.020
--
0.50
Z
2o
10o
2o
10o
G1 0.410 0.430 10.42 10.92
K1 0.040
--
1.02
--
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