2SK2788
Absolute Maximum Ratings
Item
Symbol
Drain to source voltage
VDSS
Gate to source voltage
VGSS
Drain current
Drain peak current
ID
ID(pulse)*1
Body to drain diode reverse drain current
Channel dissipation
IDR
Pch*2
Channel temperature
Tch
Storage temperature
Tstg
Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1 %
2. When using the alumina ceramic board (12.5 x 20 x 0.7 mm)
Ratings
60
±20
2
4
2
1
150
–55 to +150
(Ta = 25°C)
Unit
V
V
A
A
A
W
°C
°C
Electrical Characteristics
Item
Symbol Min
Drain to source breakdown voltage V(BR)DSS 60
Gate to source breakdown voltage V(BR)GSS ±20
Zero gate voltage drain current
IDSS
—
Gate to source leak current
IGSS
—
Gate to source cutoff voltage
VGS(off)
1.0
Static drain to source on state
resistance
RDS(on)
—
RDS(on)
—
Forward transfer admittance
|yfs|
1.6
Input capacitance
Ciss
—
Output capacitance
Coss
—
Reverse transfer capacitance
Crss
—
Turn-on delay time
td(on)
—
Rise time
tr
—
Turn-off delay time
td(off)
—
Fall time
tf
—
Body to drain diode forward voltage VDF
—
Body to drain diode reverse
recovery time
trr
—
Notes: 3. Pulse test
Typ
—
—
—
—
—
0.12
0.16
2.8
180
90
30
9
15
40
35
0.9
35
Max
—
—
10
±10
2.0
0.16
0.25
—
—
—
—
—
—
—
—
—
—
Unit
V
V
µA
µA
V
Ω
Ω
S
pF
pF
pF
ns
ns
ns
ns
V
ns
(Ta = 25°C)
Test Conditions
ID = 10 mA, VGS = 0
IG = ±100 µA, VDS = 0
VDS = 60 V, VGS = 0
VGS = ±16 V, VDS = 0
ID = 1 mA, VDS = 10 V
ID = 1 A, VGS = 10 V*3
ID = 1 A, VGS = 4 V*3
ID = 1 A, VDS = 10 V*3
VDS = 10 V, VGS = 0,
f = 1 MHz
VGS = 10 V, ID = 1 A,
RL = 30 Ω
ID = 2 A, VGS = 0
IF = 2 A, VGS = 0
diF/ dt = 50A/µs
Rev.2.00 Sep. 07, 2005 page 2 of 6