LA76834 查看數據表（PDF） - SANYO -> Panasonic

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LA76834

Announcement of Changes to Inner Box Markings and Pin Plating Associated ith Switching to Lead-Free Specifications for IC Pins (Products Affected: BIP Through Hole Devices)

SANYO -> Panasonic 

Ordering number : ENN8003A

Replace the SANYO Semiconductor NEWS No. 8003 with 8003A.

Announcement of Changes to Inner Box Markings and Pin Plating Associated with

Switching to Lead-Free Specifications for IC Pins

(Products Affected: BIP Through Hole Devices)

Thank you for your continued use of our semiconductor products.

Please note that, as captioned above, SANYO is making the following changes.

Please make a note of this if you use these or related products.

1. Changes

(1) The plating material used on the IC pins has been changed from SnPb plating to a SnBi (1 to 4% Bi by weight)

material.

(2) The words "LEAD FREE" have been added to the markings on the inner box (packing case) and the suffix "-E" has

been added to the product number. (See the following page.)

2. Affected Products

See the BIP Trough Hole Devices table.

3. Reason

The SANYO Electric Group has established the "Action E21"environmental action plan to work together for con-

tinued improvement in SANYO's environmental performance. As part of these activities, SANYO Electric Semi-

conductor Company is progressing with its plan to eliminate all lead from lead pins by the end of 2005.

To move forward with its efforts, SANYO is informing its customers of these changes in devices for which lead-free

specification environments (development of manufacturing locations for mass-production and achievement of

required heat resistance characteristics) are already in place.

Changes only affect the material of lead pin plating for the targeted products. Therefore, the affected products will

not experience any deviation electrically or in terms of their reliability. Furthermore, these changes will not affect

current mounting processes used by customers. Device specifications fully support conversion of customer’s existing

manufacturing lines to lead-free lines.

4. Implementation data

Shipment of lead-free products will begin starting November, 2005. The change will be applied sequentially to differ-

ent products. The exact date of the start of shipments may be slightly delayed because of stock conditions for some of

the products. Please contact your SANYO sales representative if you have any questions or require more detailed

information regarding this change.

Details (Continued on next page.)

(1) Notes on the heat resistance of lead-free products

(2) Examples of lead-free product labeling

(3) Notes on solderability

(4) Plated joint strength (reference data)

Continued on following page.

SANYO Electric Co.,Ltd. Semiconductor Company

TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN

O3005 HK IM No.8003-1/5

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