MPC7447A 查看數據表（PDF） - Freescale Semiconductor

零件编号

产品描述 (功能)

生产厂家

MPC7447A

RISC Microprocessor Hardware Specifications

Freescale Semiconductor 

General Parameters

Table 1. Microarchitecture Comparison (continued)

Microarchitectural Specs

Number of 32-byte sectors/line

Parity

Dynamic frequency switching (DFS)

Thermal diode

MPC7447A

Thermal Control

Yes

Yes

MPC7447 MPC7445

2

Byte

No

No

No

No

MPC7441

No

No

4 General Parameters

The following list is a summary of the general parameters of the MPC7447A:

Technology

Die size

0.13-μm CMOS, nine-layer metal

8.51 mm × 9.86 mm

Transistor count

48.6 million

Logic design

Fully-static

Packages

Surface mount 360 ceramic ball grid array (HCTE)

Surface mount RoHS-compliant 360 ceramic ball grid array (HCTE)

Surface mount 360 ceramic land grid array (HCTE)

Core power supply

1.3 V ± 50 mV DC (nominal), or

1.2 V ± 50 mV DC (derated)

I/O power supply

1.8 V ± 5% DC, or

2.5 V ± 5% DC

5 Electrical and Thermal Characteristics

This section provides the AC and DC electrical specifications and thermal characteristics for the

MPC7447A.

5.1 DC Electrical Characteristics

The tables in this section describe the MPC7447A DC electrical characteristics. Table 2 provides the

absolute maximum ratings.

Table 2. Absolute Maximum Ratings1

Characteristic

Core supply voltage

PLL supply voltage

Processor bus supply voltage

Input voltage

BVSEL = 0

BVSEL = HRESET or OVDD

Processor bus

JTAG signals

Symbol Maximum Value Unit Notes

VDD

–0.3 to 1.60

V2

AVDD

–0.3 to 1.60

V2

OVDD

–0.3 to 1.95

V 3, 4

OVDD

–0.3 to 2.7

V 3, 5

Vin –0.3 to OVDD + 0.3 V 6, 7

Vin –0.3 to OVDD + 0.3 V —

MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5

Freescale Semiconductor

9

Share Link: