SFH4250(2009) 查看數據表（PDF） - OSRAM GmbH

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SFH4250
(Rev.:2009)

High Power Infrared Emitter (850 nm)

OSRAM GmbH 

Empfohlenes Lötpaddesign

Recommended Solder Pad Design

Padgeometrie für

verbesserte Wärmeableitung

Paddesign for

improved heat dissipation

2.3 (0.091)

0.8 (0.031)

Reflow Löten

Reflow Soldering

3.3 (0.130)

3.3 (0.130)

SFH 4250

0.7 (0.028)

Empfohlenes Lötpaddesign

Recommended Solder Pad Design

6.1 (0.240)

2.8 (0.110)

Cu Fläche /

Cu-area

Lötstoplack

Solder resist

16 mm2 per pad

OHFP3021

Wellenlöten TTW

TTW Soldering

Padgeometrie für

verbesserte Wärmeableitung

Paddesign for

improved heat dissipation

2009-05-14

2.8 (0.110) 0.5 (0.020)

Lötstoplack

Solder resist

Cu Fläche / > 16 mm2 per pad

Cu-area

OHPY3040

7

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