RC1117X25 查看數據表（PDF） - Fairchild Semiconductor
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RC1117X25 Datasheet PDF : 9 Pages
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RC1117
Mechanical Dimensions
3-Lead TO-252 Package
Symbol
A
b
b2
b3
c
c2
D
E
e
H
L
L1
L3
L4
Inches
Min. Max.
.086 .094
.025 .035
.030 .045
.205 .215
.018 .024
.018 .023
.210 .245
.250 .265
.090 BSC
.370 .410
.055 .070
.108 REF
.035 .080
.025 .040
Millimeters
Min. Max.
2.19 2.39
0.64 0.89
0.76 1.14
5.21 5.46
0.46 0.61
0.46 0.58
5.33 6.22
6.35 6.73
2.29 BSC
9.40 10.41
1.40 1.78
2.74 REF
0.89 2.03
0.64 1.02
Notes
4
1
1
3
4
PRODUCT SPECIFICATION
Notes:
1. Dimensions are exclusive of mold flash and metal burrs.
2. Stand off-height is measured from lead tip with ref. to Datum -B-.
3. Foot length is measured with ref. to Datum -A- with lead surface.
4. Thermal pad contour optional within dimensions b3 and L3
5. Formed leads to be planar with respect to one another at seating
plane -C-.
6. Dimensions and tolerances per ASME Y14.5M-1994.
E
@PKG/
@HEATSINK
b3
L3
c2
D
H
E-PIN
L4
b2
b
e
A
-C-
L1
L
c
α = 0°–10°
-B- -A-
REV. 1.3.0 3/28/02
7
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