RHR1K160 查看數據表（PDF） - Intersil

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RHR1K160

1A, 600V Hyperfast Diode

Intersil 

RHR1K160

Test Circuits and Waveforms (Continued)

L = 20mH

R < 0.1Ω

EAVL = 1/2LI2 [VR(AVL)/(VR(AVL) - VDD)]

Q1 = IGBT (BVCES > DUT VR(AVL))

LR

CURRENT

SENSE

Q1

+

VDD

DUT

VDD

-

FIGURE 11. AVALANCHE ENERGY TEST CIRCUIT

Thermal Resistance vs Mounting Pad Area

The maximum rated junction temperature, TJM, and the

thermal resistance of the heat dissipating path determines

the maximum allowable device power dissipation, PDM, in an

application. Therefore the application’s ambient temperature,

TA (oC), and thermal resistance RθJA (oC/W) must be

reviewed to ensure that TJM is never exceeded. Equation 1

mathematically represents the relationship and serves as

the basis for establishing the rating of the part.

PDM = -(--T----J-Z--M--θ----J–---A-T----A----)

(EQ. 1)

In using surface mount devices such as the SO-8 package,

the environment in which it is applied will have a significant

influence on the part’s current and maximum power

dissipation ratings. Precise determination of the PDM is

complex and influenced by many factors:

1. Mounting pad area onto which the device is attached and

whether there is copper on one side or both sides of the

board.

2. The number of copper layers and the thickness of the

board.

3. The use of external heat sinks.

4. The use of thermal vias.

5. Air flow and board orientation.

6. For non steady state applications, the pulse width, the

duty cycle and the transient thermal response of the part,

the board and the environment they are in.

Intersil provides thermal information to assist the designer’s

preliminary application evaluation. Figure 13 defines the

RθJA for the device as a function of the top copper

(component side) area. This is for a horizontally positioned

FR-4 board with 2 oz. copper after 1000 seconds of steady

state power with no air flow. This graph provides the

necessary information for calculation of the steady state

VAVL

IL

IL

IV

t0

t1

t2

t

FIGURE 12. AVALANCHE CURRENT AND VOLTAGE

WAVEFORMS

junction temperature or power dissipation. Pulse

applications can be evaluated using the Intersil device Spice

thermal model or manually utilizing the normalized maximum

transient thermal impedance curve.

350

ln RθJA = 101.6 - 25.82 x (AREA)

300

250

200

217oC/W - 0.0123in2

150

177oC/W - 0.054in2

100

50

0.001

0.01

0.1

1.0

CATHODE MOUNTING AREA, TOP COPPER AREA (in2)

FIGURE 13. THERMAL RESISTANCE vs MOUNTING PAD

AREA

Displayed on the curve are RθJA values listed in the

Electrical Specifications table. These points were chosen to

depict the compromise between the copper board area, the

thermal resistance and ultimately the power dissipation,

PDM. Thermal resistances corresponding to other

component side copper areas can be obtained from Figure

13 or by calculation using Equation 2. The area, in square

inches is the top copper area including the cathode pad

area.

RθJA = 101.6 – 25.82 × ln (Area)

(EQ. 2)

3-5

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