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AM29F200AB-90DPC1 查看數據表(PDF) - Advanced Micro Devices

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AM29F200AB-90DPC1 Datasheet PDF : 8 Pages
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SUPPLEMENT
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29F200A
T
-90
DP
C
1
DIE REVISION
This number refers to the specific AMD manufacturing
process and product technology reflected in this
document. It is entered in the revision field of AMD
standard product nomenclature.
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (–40°C to +85°C)
E = Extended (–55°C to +125°C)
PACKAGE TYPE AND
MINIMUM ORDER QUANTITY
DP = Waffle Pack
245 die per 5 tray stack
DG = Gel-Pak® Die Tray
486 die per 6 tray stack
DT =
DW =
Surftape™ (Tape and Reel)
2500 per 7-inch reel
Gel-Pak® Wafer Tray (sawn wafer on frame)
Call AMD sales office for minimum order
quantity
SPEED OPTION
See Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29F200A Known Good Die
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS Flash Memory—Die Revision 1
5.0 Volt-only Read, Program, and Erase
Valid Combinations
Am29F200AT-90,
Am29F200AB-90
Am29F200AT-120,
Am29F200AB-120
DPC 1, DPI 1, DPE 1,
DGC 1, DGI 1, DGE 1,
DTC 1, DTI 1, DTE 1,
DWC 1, DWI 1, DWE 1
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
1/13/98
Am29F200A Known Good Die
5

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