AM29F200AB-90DGC1 查看數據表（PDF） - Advanced Micro Devices
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AM29F200AB-90DGC1
Advanced Micro Devices
AM29F200AB-90DGC1 Datasheet PDF : 8 Pages
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SUPPLEMENT
PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Die test flow. For more detailed information, refer to the
Am29F200A product qualification database supple-
ment for KGD. AMD implements quality assurance pro-
cedures throughout the product test flow. In addition,
an off-line quality monitoring program (QMP) further
guarantees AMD quality standards are met on Known
Good Die products. These QA procedures also allow
AMD to produce KGD products without requiring or
implementing burn-in.
Wafer Sort 1
Bake
24 hours at 250°C
DC Parameters
Functionality
Programmability
Erasability
Data Retention
Wafer Sort 2
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 3
High Temperature
DC Parameters
Functionality
Programmability
Erasability
Speed
Packaging for Shipment
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
Shipment
Figure 1. AMD KGD Product Test Flow
6
Am29F200A Known Good Die
1/13/98
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