AM29F200AT-90DGE1 查看數據表（PDF） - Advanced Micro Devices

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AM29F200AT-90DGE1

2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 5.0 Volt-only, Sectored Flash Memory—Die Revision 1

Advanced Micro Devices 

SUPPLEMENT

PHYSICAL SPECIFICATIONS

Die dimensions . . . . . . . . . . . . . . 191 mils x 174 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . . 4.85 mm x 4.42 mm

Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils

Bond Pad Size . . . . . . . . . . . . . . 4.55 mils x 4.55 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . 115.6 µm x 115.6 µm

Pad Area Free of Passivation . . . . . . . . . .20.70 mils2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13,363 µm2

Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si

Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,

may be grounded (optional)

Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride

DC OPERATING CONDITIONS

VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V

Junction Temperature Under Bias . .TJ (max) = 130°C

Operating Temperature

Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C

Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C

Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C

MANUFACTURING INFORMATION

Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL

Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC

Manufacturing ID (Top Boot) . . . . . . . . . . . . 98483AK

(Bottom Boot) . . . . . . . .98483ABK

Preparation for Shipment . . . . . . . . Penang, Malaysia

Fabrication Process . . . . . . . . . . . . . . . . . . . CS29AF

Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SPECIAL HANDLING INSTRUCTIONS

Processing

Do not expose KGD products to ultraviolet light or

process them at temperatures greater than 250°C.

Failure to adhere to these handling instructions will

result in irreparable damage to the devices. For best

yield, AMD recommends assembly in a Class 10K

clean room with 30% to 60% relative humidity.

Storage

Store at a maximum temperature of 30°C in a nitrogen-

purged cabinet or vacuum-sealed bag. Observe all

standard ESD handling procedures.

1/13/98

Am29F200A Known Good Die

7

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