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1N5811U(2015) 查看數據表(PDF) - STMicroelectronics

零件编号
产品描述 (功能)
生产厂家
1N5811U
(Rev.:2015)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
1N5811U Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
1N5811U
3
Ordering information
Ordering information
Table 7. Ordering information(1)
Order code
ESCC detailed
specification
Package Lead finish
Marking(2)
EPPL Mass
Packing
1N5811UB1
1N5811U01B
1N5811U02B
-
5101/013/11
5101/013/12
Gold
1N5811UB1 -
LCC2B
Gold
510101311 Y 0.18 g Waffle pack
Solder dip 510101312 Y
1. Contact ST sales office for information about the specific conditions for products in die form.
2. Specific marking only. The full marking includes in addition:
For the engineering models: ST logo, date code, country of origin (FR).
For ESCC flight parts: ST logo, date code, country of origin (FR), ESA logo, serial number of the part within the assembly lot.
4
Other information
4.1
Date code
Date code is structured as describe below:
EM xyywwz
ESCC flight yywwz
Where:
x (EM only): 3, assembly location Rennes (France)
yy: last two digits year
ww: week digits
z: lot index in the week
4.2
Documentation
In Table 8 is a summary of the documentation provided with each type of products.
Table 8. Documentation provided with each type of products
Quality level
Documentation
Engineering model
ESCC flight
Certificate of conformance
DocID16005 Rev 4
7/9
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