21-0159 查看數據表（PDF） - Dallas Semiconductor -> Maxim Integrated

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21-0159

PACKAGE OUTLINE, 40L THIN QFN 5x5x0.8mm BODY / 0.4mm LEAD PITCH

Dallas Semiconductor -> Maxim Integrated 

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES IN DEGREES.

2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. COPLANARITY SHALL NOT EXCEED 0.08mm.

3. WARPAGE SHALL NOT EXCEED 0.10mm.

4. PACKAGE LENGTH / PACKAGE WIDTH ARE CONSIDERED AS SPECIAL CHARACTERISTICS. (S)

5. REFER TO JEDEC MO-220.

6. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012.

DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1

IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.

7. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.

SYMBOLS

A

A1

A2

b

D

e

E

k

k1

L

L1

N

ND

NE

COMMON DIMENSIONS

MIN.

NOM.

MAX.

0.700

0.750

0.800

0.000

-- --

0.050

0.200 REF.

0.150

0.200

0.250

4.900

5.000

5.100

0.400 TYP.

4.900

5.000

5.100

0.250

0.350

0.450

0.350

0.450

0.550

0.400

0.500

0.600

0.300

0.400

0.500

40

10

10

EXPOSED PAD VARIATONS

PKG.

CODE

D2

E2

MIN. NOM. MAX. MIN. NOM. MAX.

T4055-1 3.20 3.30 3.40 3.20 3.30 3.40

PACKAGE OUTLINE, 40L THIN QFN

5x5x0.8mm BODY / 0.4mm LEAD PITCH

21-0159

A

2

2

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