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AD5313BRU-REEL(RevA) 查看數據表(PDF) - Analog Devices

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AD5313BRU-REEL Datasheet PDF : 20 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ABSOLUTE MAXIMUM RATINGS1, 2
(TA = 25°C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to GND . . . . . . –0.3 V to VDD + 0.3 V
Reference Input Voltage to GND . . . . . –0.3 V to VDD + 0.3 V
VOUTA, VOUTB to GND . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (A, B Version) . . . . . . . . . . . . . . –40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature (TJ Max) . . . . . . . . . . . . . . . . . . 150°C
16-Lead TSSOP Package
Power Dissipation . . . . . . . . . . . . . . . . . . . (TJ Max – TA)/JA
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 160°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch-up.
AD5303/AD5313/AD5323
PIN CONFIGURATION
CLR 1
16 SDO
LDAC 2
15 GND
AD5303/
VDD 3 AD5313/ 14 DIN
VREFB 4 AD5323 13 SCLK
TOP VIEW
VREFA 5 (Not to Scale) 12 SYNC
VOUTA 6
11 VOUTB
BUF A 7
10 PD
BUF B 8
9 DCEN
Model
AD5303ARU
AD5303ARU-REEL7
AD5313ARU
AD5313ARU-REEL7
AD5323ARU
AD5323ARU-REEL7
AD5303BRU
AD5303BRU-REEL
AD5303BRU-REEL7
AD5313BRU
AD5313BRU-REEL
AD5313BRU-REEL7
AD5323BRU
AD5323BRU-REEL
AD5323BRU-REEL7
ORDERING GUIDE
Temperature Range
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
Package Description
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Package Option
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD5303/AD5313/AD5323 feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
REV. A
–5–

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